ASM International N.V. and the University of Helsinki announced that they have renewed their long-term research agreement in the field of Atomic Layer Deposition for another five years, a press release by ASM International stated.
Atomic Layer Deposition (ALD) is an advanced technology for depositing thin film materials one atom at a time, for use in integrated circuits and other applications. ASM and the University of Helsinki have been pioneers in ALD technology for two decades.
"The cooperation of University basic ALD research and ASM equipment development has proved very successful in bringing ALD process technology to the semiconductor industry since this project began in 2004,” ASM Chief Technology Officer Ivo Raaijmakers said.
“It has also strengthened our portfolio of Intellectual Property Rights in this process technology platform. Recently, the accord has generated some key innovations in such areas as noble metals and phase change materials deposition, previously thought impossible with ALD, which are currently under study for high volume manufacturing," he added.
One of the oldest universities in Europe, the University of Helsinki, founded in 1640, concentrates on high-level scientific research and researcher education.
ASM International N.V. and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices.
SOURCE:AGIPNEWS
