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3M and EV Group Settle Patent Infringement Suit

2008/12/29

ST. PAUL, MINN. & ST. FLORIAN, AUSTRIA - 3M and EV Group (EVG) have agreed to settle the patent infringement litigation brought by EVG against 3M in the US District Court for the Southern District of New York relating to systems for temporary wafer bonding, a press release by 3M stated.

 

Under the terms of the settlement, the details of which are confidential, 3M, its customers, and 3M’s licensed suppliers of 3M's Wafer Support System will continue to make, sell and use the Wafer Support System in global semiconductor and packaging markets. EVG will continue to defend its patent portfolio and protect its Intellectual Property.

 

EV Group is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. A recognized leader in research and development, 3M produces thousands of innovative products for dozens of diverse markets.


From:www.ag-ip-news.com




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